The new Dimensity 1050 is MediaTek’s first chip to support mmWave

MediaTek has come a long way since its misstep when LTE was a fledgling technology, and while it's made huge inroads in the 5G market there's one market that it has failed to crack with its impressive array of Dimensity processors – the US. The lack of penetration in the US market has mostly down to current Dimensity chipsets offering support for sub-6GHz 5G connectivity and not for the ultra-fast mmWave technology. But that's something that is about to change thanks to the launch of the Dimensity 1050 which, for the first time, features support for the all-important mmWave network.

“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands,” said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. “With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines.”

Offering dual connectivity with mmWave and sub-6GHz, the Dimensity 1050 System-on-a-Chip is built on the efficient 6nm process from TSMC. Besides the 5G optimizations, the new chip features MediaTek's HyperEngine 5.0 gaming technology to ensure low-latency connections with tri-band networks (2.4GHz/5GHz/6GHz) which aims to extend game time and performance. UFS 3.1 storage is supported, as is LPDDR5 memory, which should help make accessing data streams on the device faster and improve FPS when gaming.

Additional features of the Dimensity 1050 include:

• Support for True Dual 5G SIM (5G SA + 5G SA) and Dual VoNR.
• Super-fast 144Hz Full HD+ displays with intense, vibrant colors through MediaTek’s MiraVision 760.
• Dual HDR video capture engine, enabling users to simultaneously stream with the front and rear cameras.
• Excellent noise reduction for superb low-light photos and MediaTek’s APU 550 improves AI camera actions.
• Wi-Fi 6E support for superior power efficiency and 2×2 MIMO antenna brings faster, more reliable connections.

Besides the Dimensity 1050, MediaTek also announced the Dimensity 930 and the Helio G99 processors:

• The Dimensity 930 enables 5G smartphones to download data faster and stay connected regardless of location with 2CC-CA, including mixed duplex FDD+TDD for higher speeds and greater reach. Designed to capture vibrant details, it is equipped with MiraVision HDR video playback and display for 120Hz Full HD+ displays and HDR10+ video. Additionally, HyperEngine 3.0 Lite gaming enhancements bring intelligent multi-network management to ensure lower latency for smooth user experiences and maximized battery life.
• The Helio G99 powers incredible mobile gaming experiences on 4G/LTE for higher throughput rates and more than 30 percent power savings for gaming compared to the Helio G96. This SoC will be available to customers in the second quarter of 2022.•

MediaTek says that we can expect the first smartphones powered by the Dimensity 1050 and Helio G99 to go on sale sometime during Q3 of 2022 while phones using the Dimensity 930 should come to market before the end of Q2.