Having unveiled the Magic Vs during MWC 2023 in Barcelona, Honor is gearing up to take the wraps off of its fully-fledged successor – the Magic V2. Unlike the Vs which was basically an update of Honor's first foldable, the Magic V2 promises to be a proper successor with new hardware and software features.
In an interview with John Hoffman of the GSMA, Honor CEO George Zhao gave a sneak preview of the upcoming Magic V2 which is set to launch in China on July 12.
“Smartphones represent the ultimate combination of computing systems, communications technologies, display technologies, and AI platforms, tearing down boundaries by integrating various other devices and new technologies. New AI and communications technology are fueling a new wave of smartphone innovation, creating virtually limitless possibilities for us to explore. It is our responsibility as a company to embrace these opportunities and continue to push the boundaries of what is possible with smartphones.”
George Zhao, CEO of HONOR Device Co. Ltd.
Depending on the market, it's thought (and hoped) that the Magic V2 could be powered by Qualcomm's Snapdragon 8 Gen 2 chipset with up to 16GB of RAM and upto 512GB of built-in storage. It's also reported that the Magic V2 will sport an LTPO display with 2K resolution. Honor's latest foldable may also feature a big 5,000mAh battery with support for 66W wired and 50W wireless charging. One area we would like to see address is ingress protection and hopefully Honor will furnish the Magic V2 with some sort of IP certification against water and dust.
July is shaping up to be a busy month for phone launches with Samsung's Unpacked event towards the end of the month and Honor's own 90 Series of mid-rangers set to launch in Paris on the 6th.
