After unveiling the new Dimensity 9300 flagship processor, MediaTek has just announced the Dimensity 8300 chipset which will power a range of affordable but still premium smartphones. As with the flagship chip, the Dimensity 8300 features on-device generative AI plus hefty performance and power efficiency boosts.
Unlike the 9300 which went big on all its cores, the Dimensity 8300 stays faithful to the more traditional 1+3+4 architecture using ARMv9 cores that includes a Cortex-X3 prime core alongside a trio of Cortex-A715 cores and a foursome of Cortex-A510 efficiency cores. The Dimensity 8300 is built using the 4nm manufacturing process and will sport a Mali G52 MC6 graphic processing unit.
Compared to the 8200, the Dimensity 8300 offers 60% more performance and 55% better power efficiency, and supports LPDDR5X memory at higher clock speeds as well as the much quicker UFS 4.0.
Other key features of the MediaTek Dimensity 8300 include:
● LP5x 8533Mbps and UFS4.0 MCQ memory provides a 33% speed boost on LPDDR and up to
100% faster R/W to flash compared to Dimensity 8300’s predecessor.
● MediaTek 5G UltraSave 3.0+ improves 5G power efficiency up to 20% in daily usage scenarios
compared to the previous generation.
● Upgraded Wi-Fi 6E performance with 160 MHz bandwidth, plus Wi-Fi/Bluetooth hybrid
coexistence technology so earbuds, wireless gamepads, and other peripherals work together
seamlessly.
● Dimensity 5G Open Resource Architecture (DORA), allowing device makers to create unmatched
smartphones that stand out in unique ways amongst competitors.
We should see the first Dimensity 8300-powered smartphones launching in the global market before the end of 2023.
