Qualcomm’s Snapdragon series processors are known to be some of the best CPUs on the market for mobile devices, but the company isn’t known for manufacturing any other internals for phones and tablets. Qualcomm will look to change that this year.
The company plans to dominate the market for internal components for smartphones, and it’s expected that a fully-built Qualcomm phone will be unveiled by the end of the year.
The RF360, a new RF device by Qualcomm, will reside between the baseband and the antenna in new devices. Qualcomm says that it consumes less power, takes up less space and supports the rapidly proliferating number of LTE bands used throughout the world.
This device, alongside the RF Pop, a power amplifier, will make it into handsets this year and should mark a major change in mobile technology. We’ll just have to wait and see how all of this pans out and see whether OEMs embrace Qualcomm’s new RF devices or not.