A few days ago, we heard that Qualcomm’s new Snapdragon 820 chipset would be revealed on August 11 but it turns out this isn’t the case.
Qualcomm’s event scheduled for Tuesday in Los Angeles is actually the SIGGRAPH 2015 conference to bring new computer graphics technology. The conference got mixed up with all the rumors about the Snapdragon 820 chipset and its alleged high speeds and performance increases. Analyst Pan Jiutang stated the new chip will start shipping in December and will debut inside the Xiaomi Mi 5 which is expected to launch in March of 2016.
According to recent leaks and tests, the Snapdragon 820 will bring many new enhancements and will not heat up like the Snapdragon 810 chip. It allegedly includes a 40% performance boost and an all-new Adreno 530 graphics core. The company has put together four new custom cores that will bring this large boost in performance.
Reportedly, manufacturers such as LG, HTC and Sony have already received samples of the new chipset in order to test for their upcoming flagships. These flagships are scheduled to launch in Q1 of 2016. Qualcomm has a lot riding on this processor and will have its work cut out time come this winter.